| Item | Mass Production | Sample |
|
Max. Layers
|
16layers
|
30layers
|
|
Max. Board Size
|
21"x24"
|
21"x26”
|
|
Material
|
FR4,CEM1,High Tg, Al base, Copper base, Teflon, etc.
|
Rogers, Nelco, etc.
|
|
Max. Board Thickness
|
0.4mm～6.0mm
|
<0.4mm and >7.00mm
|
|
Min. Core Thickness
|
0.10mm
|
0.10mm
|
|
Min. Track Width/Space
|
4mil/4mil
|
3mil/3mil
|
|
Max. Copper Thickness
|
Inner Layer: 6Oz
|
Inner Layer: 8Oz
|
|
|
Outer Layer: 8Oz
|
Outer Layer: 10 Oz
|
|
Min. Drill Size
|
0.2mm
|
0.15mm
|
|
Min. Laser Drill Size
|
0.1mm
|
0.076mm
|
|
PTH Diameter Tolerance
|
±3mil
|
±2mil
|
|
Aspect Ratio
|
8:1
|
12:1
|
|
PTH Wall Thickness
|
18um-25um
|
16um-35um
|
|
Min solder mask bridge
|
0.13mm
|
0.10mm
|
|
Min solder mask window
|
0.10mm
|
0.08mm
|
|
V-cutting Tolerance
|
±0.13mm
|
±0.10mm
|
|
Outline Dimension
|
±0.13mm
|
±0.10mm
|
|
Warp and Twist
|
≤0.7%
|
≤0.5%
|
|
Blinded and Buried Via Holes
|
Yes
|
Yes
|
|
Controlled Impedance
|
±10%
|
±7%
|
|
HDI Board
|
1+N+1
|
2+N+2
|
|
Surface Treatment
|
HASL
|
HASL
|
|
Surface Treatment
|
HASL Lead Free
|
HASL Lead Free
|
|
Immersion Gold
|
Immersion Gold
|
|
|
Immersion Tin
|
Immersion Tin
|
|
|
Immersion Silver
|
Immersion Silver
|
|
|
Flash Gold
|
Flash Gold
|
|
|
OSP
|
OSP
|
|
|
Gold Finger
|
Gold Finger
|
|
|
Selective
|
Selective
|
