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Rigid PCB Capability
Flexible PCB Capability
SMT Capability
 
Capability
 
 
Rigid PCB Capability

Item
Mass Production
Sample
Max. Layers
16layers
30layers
Max. Board Size
21"x24"
21"x26”
Material
FR4,CEM1,High Tg, Al base material, PT material, etc.
Rogers, Nelco, etc.
Max. Board Thickness
0.4mm~6.0mm
<0.4mm and >7.00mm
Min. Core Thickness
0.10mm
0.10mm
Min. Track Width/Space
4mil/4mil
3mil/3mil
Max. Copper Thickness
Inner Layer: 6Oz
Inner Layer: 8Oz
 
Outer Layer: 8Oz
Outer Layer: 10 Oz
Min. Drill Size
0.2mm
0.15mm
Min. Laser Drill Size
0.1mm
0.076mm
PTH Diameter Tolerance
±3mil
±2mil
Aspect Ratio
8:1
12:1
PTH Wall Thickness
18um-25um
16um-35um
Min solder mask bridge
0.13mm
0.10mm
Min solder mask window
0.10mm
0.08mm
V-cutting Tolerance
±0.13mm
±0.10mm
Outline Dimension
±0.13mm
±0.10mm
Warp and Twist
≤0.7%
≤0.5%
Blinded and Buried Via Holes
Yes
Yes
Controlled Impedance
±10%
±7%
HDI Board
1+N+1
2+N+2
Surface Treatment
HASL
HASL
Surface Treatment
HASL Lead Free
HASL Lead Free
Immersion Gold
Immersion Gold
Immersion Tin
Immersion Tin
Immersion Silver
Immersion Silver
Flash Gold
Flash Gold
OSP
OSP
Gold Finger
Gold Finger
Selective
Selective

 

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